Free DFM review
Send your submount or package drawing — we respond within 2 business days with feasibility, lead time, MOQ, and risk points. No obligation.
What you get
- SiC vs ALN material recommendation for your power and CTE requirements
- Manufacturability go / no-go on pad geometry and metallization
- Lead time estimate and MOQ confirmation (custom typically 2,000 pcs)
- Risk flags: thermal path, CTE mismatch, bond pad access
Frequently asked questions
What do I receive from a FerraLink DFM review?
Within 2 business days: material recommendation (SiC vs ALN), manufacturability assessment, estimated lead time, MOQ confirmation (typically 2,000 pcs for custom), metallization and CTE flags, and any stack risks we see in your drawing.
Is the DFM review free?
Yes — no obligation. Submit your drawing via this form or email info@ferralink.com. We respond within 2 business days.
What files should I upload?
DXF, DWG, Gerber, STEP, or PDF drawing showing submount outline, pad positions, and metallization if known. Include chip size and power/thermal context in the form fields.
Need standard samples instead? Order a sample box · How we work