Products
FerraLink organizes hardware the way packaging engineers build stacks: thermal spreading at the die, then a hermetic metal envelope, then active cooling when needed. We add selection context suppliers rarely publish — and ship submount samples in 2–4 weeks.
Thermal submounts
Die-level thermal spreading organized by application — laser emitters, datacom modules, and power/RF stacks. Single-crystal SiC and polycrystalline AlN samples ship in 2–4 weeks; datacom and power lines are quoted per drawing.
By application · samples in 2–4 weeks
Hermetic metal packages
Metal-ceramic shells that seal, route pins, and define the mechanical envelope around your die — TO headers, butterfly modules, cavity packages, windows, feedthroughs, and mount hardware.
83 catalog outlines
Active thermal
TEC modules, cold plates, and active cooling assemblies — catalog in progress.
Coming soon