Engineering services

FerraLink is not only a parts supplier — we help packaging engineers select materials, freeze stackups, and move from standard sample evaluation to custom production with confidence.

Quick answer

Start with a free DFM review on your drawing (2 business day response). For deeper support, we offer submount co-design and a prototype-to-production path — standard samples first, then custom release at typical 2,000 pc MOQ.

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DFM review

Free with quote request

Send your drawing or stack definition — we respond within 2 business days with feasibility, lead time, MOQ, and risk points.

What you get

  • Substrate material recommendation (single-crystal SiC vs polycrystalline ALN)
  • Metallization stack fit for your die attach and wire bond process
  • CTE and thermal path flags relative to your chip and package
  • MOQ and lead time estimate (custom typically 2,000 pc MOQ)
  • Clear go / no-go on manufacturability before you commit
Send drawings for DFM review →
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Submount & package co-design

Scoped engagement

We review your chip, power budget, and system constraints — then propose a submount + header/package stackup with part numbers and documentation path.

What you get

  • Chip size, pad layout, and thermal dissipation review
  • Submount geometry and metallization definition
  • TO header or cavity package pairing where applicable
  • Stack diagram and bill of materials for procurement
  • Alignment with your reliability and environmental targets
Schedule a technical walkthrough →
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Prototype to production

Volume path

A structured path from standard sample evaluation to custom production release — with clear MOQ and documentation at each stage.

What you get

  • Stage 1 — Standard samples: catalog ALN or SiC box (2–4 weeks, small volume only)
  • Stage 2 — Custom qualification lot: typically 2,000 pc MOQ, drawing frozen
  • Stage 3 — Production release: repeat POs against qualified drawing revision
  • Test strategy guidance: incoming inspection, die attach trial, thermal cycling
  • Documentation package for your supplier qualification file
See how we work →

Typical engagement flow

  1. 1Evaluate material — order a standard ALN or SiC sample box (small volume, 2–4 weeks).
  2. 2DFM review — send your custom drawing; receive feasibility and MOQ/lead time within 2 business days.
  3. 3Qualification lot — custom release, typically 2,000 pc MOQ, drawing revision frozen.
  4. 4Production — repeat orders against qualified specification with ongoing lot documentation.
Full ordering & MOQ details →

Frequently asked questions

Is the DFM review really free?expand_more
Yes. Send your submount or package drawing to info@ferralink.com and we will respond within 2 business days with feasibility feedback, estimated lead time, MOQ (typically 2,000 pcs for custom), and any manufacturability risks — with no obligation to place an order.
When should I use co-design vs ordering standard samples?expand_more
Order standard samples first when you want to validate material and metallization in your assembly process. Engage co-design when you have a defined chip and system requirement but need help selecting submount material, geometry, metallization, and package pairing before freezing a custom drawing.
What is the MOQ for custom production?expand_more
Custom geometries and metallizations typically require 2,000 pieces per release. Standard catalog sample boxes are available in small quantity (10 pieces) without custom MOQ — see our How we work page for details.

Send a drawing for DFM review

DXF, DWG, Gerber, STEP, or PDF — response within 2 business days.

Start DFM review