Engineering services

FerraLink is not only a parts supplier — we help packaging engineers select materials, freeze stackups, and move from standard sample evaluation to custom production with confidence.

How we work — MOQ & lead timesEngineering programs

Quick answer

Start with a free DFM review on your drawing (2 business day response). For deeper support, we offer submount co-design and a prototype-to-production path — standard samples first, then custom release at typical 2,000 pc MOQ.

DFM review

Free with quote request

Send your drawing or stack definition — we respond within 2 business days with feasibility, lead time, MOQ, and risk points.

What you get

  • Substrate material recommendation (single-crystal SiC vs polycrystalline ALN)
  • Metallization stack fit for your die attach and wire bond process
  • CTE and thermal path flags relative to your chip and package
  • MOQ and lead time estimate (custom typically 2,000 pc MOQ)
  • Clear go / no-go on manufacturability before you commit
Send drawings for DFM review →

Submount & package co-design

Scoped engagement

We review your chip, power budget, and system constraints — then propose a submount + header/package stackup with part numbers and documentation path.

What you get

  • Chip size, pad layout, and thermal dissipation review
  • Submount geometry and metallization definition
  • TO header or cavity package pairing where applicable
  • Stack diagram and bill of materials for procurement
  • Alignment with your reliability and environmental targets
Schedule a technical walkthrough →

Prototype to production

Volume path

A structured path from standard sample evaluation to custom production release — with clear MOQ and documentation at each stage.

What you get

  • Stage 1 — Standard samples: catalog ALN or SiC box (2–4 weeks, small volume only)
  • Stage 2 — Custom qualification lot: typically 2,000 pc MOQ, drawing frozen
  • Stage 3 — Production release: repeat POs against qualified drawing revision
  • Test strategy guidance: incoming inspection, die attach trial, thermal cycling
  • Documentation package for your supplier qualification file
See engineering packages →

Typical engagement flow

  1. 1Evaluate material — order a standard ALN or SiC sample box (small volume, 2–4 weeks).
  2. 2DFM review — send your custom drawing; receive feasibility and MOQ/lead time within 2 business days.
  3. 3Qualification lot — custom release, typically 2,000 pc MOQ, drawing revision frozen.
  4. 4Production — repeat orders against qualified specification with ongoing lot documentation.
Full ordering & MOQ details →

Frequently asked questions

Is the DFM review really free?
Yes. Send your submount or package drawing to info@ferralink.com and we will respond within 2 business days with feasibility feedback, estimated lead time, MOQ (typically 2,000 pcs for custom), and any manufacturability risks — with no obligation to place an order.
When should I use co-design vs ordering standard samples?
Order standard samples first when you want to validate material and metallization in your assembly process. Engage co-design when you have a defined chip and system requirement but need help selecting submount material, geometry, metallization, and package pairing before freezing a custom drawing.
What is the MOQ for custom production?
Custom geometries and metallizations typically require 2,000 pieces per release. Standard catalog sample boxes are available in small quantity (10 pieces) without custom MOQ — see our How we work page for details.

Send a drawing for DFM review

DXF, DWG, Gerber, STEP, or PDF — response within 2 business days.

Start DFM review