Thermal submounts
Die-level thermal spreading organized by application — laser emitters, datacom modules, and power/RF stacks. Single-crystal SiC and polycrystalline AlN samples ship in 2–4 weeks; datacom and power lines are quoted per drawing.
Submount quote
Request a submount quote
Email, what you are building, and a drawing if you have one. We reply within two business days with lead time and price. Catalog samples stay available below if you already know the part.
By application
By substrate
Know your material? Jump to sample pages for SiC, ALN, or diamond — same products, material-first ordering path.
All submount lines
Laser & emitter thermal
Thermal spreading at the laser chip — single-crystal SiC for maximum conductivity, polycrystalline AlN for CTE-matched edge emitters, and CVD diamond when SiC is no longer enough.
3 product lines
Datacom & optical module thermal
Submounts and spreaders for datacom TOSA/ROSA, optical transceivers, and coherent engines — including trenched and multi-layer AlN for pad routing and bond clearance.
3 product lines
Power, RF & spreaders
Spreaders and substrates for GaN/SiC power and RF — AlN with thick copper or DPC, WCu slugs for CTE match, and machined heat sinks for TEC-cooled modules.
3 product lines
Need a hermetic envelope? Browse package outlines or request a package quote