Thermal submounts
Die-level thermal spreading organized by application — laser emitters, datacom modules, and power/RF stacks. Single-crystal SiC and polycrystalline AlN samples ship in 2–4 weeks; datacom and power lines are quoted per drawing.
By application
By substrate
Know your material? Jump to sample pages for SiC, ALN, or diamond — same products, material-first ordering path.
All submount lines
Laser & emitter thermal
Thermal spreading at the laser chip — single-crystal SiC for maximum conductivity, polycrystalline AlN for CTE-matched edge emitters, and CVD diamond when SiC is no longer enough.
3 product lines
Datacom & optical module thermal
Submounts and spreaders for datacom TOSA/ROSA, optical transceivers, and coherent engines — including trenched and multi-layer AlN for pad routing and bond clearance.
3 product lines
Power, RF & spreaders
Spreaders and substrates for GaN/SiC power and RF — AlN with thick copper or DPC, WCu slugs for CTE match, and machined heat sinks for TEC-cooled modules.
3 product lines
Need a hermetic envelope? Browse package outlines or request a package quote