CVD diamond submounts are in pre-release. This page is for early access partners only — not indexed for search. Catalog samples and pricing will follow general availability.
CVD diamond · Pre-release
Diamond Submount Heat Spreaders
CVD diamond heat spreaders for extreme thermal density. In-plane thermal conductivity of 1,500–2,200 W/m·K — for programs where single-crystal SiC is no longer sufficient.
Thermal conductivity
1,500–2,200 W/m·K
In-plane, grade dependent
Structure
CVD diamond
Polycrystalline CVD diamond
Availability
Early access
Evaluation partnerships
Why diamond when SiC is not enough
Single-crystal SiC at 350–400 W/m·K is the practical ceiling for ceramic submount phonon transport today. CVD diamond pushes in-plane spreading into the 1,500–2,200 W/m·K range — the next step when junction temperature during peak pulses or CW hotspots still exceeds margin after SiC optimization.
Roughly 4–6× the in-plane thermal conductivity of single-crystal SiC — useful when phonon transport in SiC is no longer the limiting step.
Diamond is not a drop-in ALN or SiC replacement. CTE (~1 ppm/°C) and attach metallurgy require a scoped stack design. FerraLink's early access program pairs material supply with Stack Scoping or Focused Analysis so attach process and carrier geometry are validated before build.
Material comparison (indicative)
| Material | Structure | Thermal conductivity | CTE (ppm/°C) | Status |
|---|---|---|---|---|
| Diamond (FerraLink) | Polycrystalline CVD diamond | 1,500–2,200 W/m·K | 1.0–1.5 ppm/°C | Pre-release / early access |
| SiC (FerraLink) | Single crystal | 350–400 W/m·K | 3.7–4.3 | In production |
| ALN (FerraLink) | Polycrystalline | 170–210 W/m·K | 4.3–4.6 | In production |
| Alumina (Al₂O₃) | Polycrystalline | 26–30 W/m·K | 6.5–7.5 | Industry standard |
Target applications
Multi-kW laser bars where SiC spreading margin is exhausted
GaN MMIC and RF power with sub-mm hotspot control
Pulsed lidar and radar emitters above ~150 W/cm² peak density
Co-packaged photonics with tight junction-to-case ΔT budgets
Engineering notes
- Diamond tiles are typically bonded to a SiC or copper carrier — CTE mismatch is managed in the stack, not ignored.
- Metallization and die attach flows differ from standard ALN/SiC submounts; FerraLink scopes attach process with early-access partners.
- Material characterization (Raman, laser flash, cross-section SEM) ships with evaluation units.
Evaluation partnerships only. No catalog pricing or open sample box until general release.
Evaluation SKU: FL-DIA-EVAL-001
Technical guide
When to move from SiC to diamond, stack design constraints, and a decision flow for extreme power density programs.
Read: CVD diamond submounts when SiC is not enough →Early access request
Tell us about your power density and stack. We assess fit for the pre-release program and propose a scoped evaluation path — or point you to SiC/ALN if diamond is premature.
Related paths
- Stack Scoping Kit — material direction and geometry bands before diamond attach work
- Focused Analysis Package — pass/fail vs thermal targets with variant comparison
- Submount Advisor — bound SiC vs ALN before requesting diamond early access