Evaluation samples · 2–4 weeks

Laser & emitter thermal

Thermal spreading at the laser chip — single-crystal SiC for maximum conductivity, polycrystalline AlN for CTE-matched edge emitters, and CVD diamond when SiC is no longer enough.

Need a hermetic envelope? Browse package outlines · Order by substrate: SiC, ALN, diamond.

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How to choose

Start with die material and peak power density. InP/GaAs edge emitters often start on AlN; pulsed lidar and high-power bars move to SiC or diamond. Match metallization (thin film vs AuSn pre-deposit) to your attach process before fixing footprint.

3 product lines in catalog

Single-crystal SiC submount — laser diode — view 1 of 3

Single-crystal SiC submount — laser diode

350–400 W/m·K spreading for edge emitters, bars, and pulsed lidar where junction temperature margin is tight.

SiCthin-film Ti/Pt/AuAu/Sn pre-deposit
Typical use & selection notes

Typical use: 905 nm pulsed lidar, high-power edge emitters, and GaN-assisted pump lasers needing maximum die-level conductivity.

Why this line: Single-crystal SiC minimizes spreading resistance when footprint is small and peak power is high — pair with Ti/Pt/Au or Au/Sn metallization for your attach flow.

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Polycrystalline AlN submount — laser diode — view 1 of 3

Polycrystalline AlN submount — laser diode

170–210 W/m·K with CTE matched to InP and GaAs — the default for telecom and sensing edge emitters.

AlNthin-film Ti/Pt/AuAu/Sn pre-deposit
Typical use & selection notes

Typical use: InP/GaAs laser diodes, monitor photodiodes, and modules where CTE match matters more than absolute k.

Why this line: AlN balances cost and CTE for most laser chips; pre-deposited AuSn shortens assembly when void targets are aggressive.

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CVD diamond heat spreader — laser diode

CVD diamond heat spreader — laser diode

1,500–2,200 W/m·K in-plane when SiC is no longer sufficient for bar stacks or extreme duty cycles.

diamondthin-film metallization
Typical use & selection notes

Typical use: Multi-kW bars, co-packed pump lasers, and hotspots where spreading area is limited.

Why this line: Diamond is the last rung on the thermal ladder — evaluation partnerships only until catalog samples are released.

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