Hermetic packages keep moisture and contaminants away from laser chips, photodiodes, and hybrid circuits. Butterfly shells, BOX cavities, and HTCC housings trade footprint and fiber routing for cavity volume and pin count — the right choice depends on whether you are building a transceiver, a lidar emitter, or a multi-die hybrid.
Pair with die-level thermal — laser submount catalog, datacom submounts, or order SiC/ALN samples.
Butterfly packages suit fiber-pigtailed TOSA/ROSA modules. BOX cavities fit bar stacks and rectangular optics. HTCC and hybrid IC shells maximize lead count for RF photonics. Specify leak rate, operating temperature, and whether you need a TEC pocket before narrowing the list.
23 outlines in catalog
Butterfly-style hermetic package — 6-Pin Side-Window Butterfly.
Typical use: Coherent and high-speed optical modules where fiber pigtails exit from a flat butterfly footprint.
Why this line: Butterfly outlines standardize TEC placement, fiber bend radius, and monitor photodiode routing versus round TO cans.
Butterfly-style hermetic package — 14-Pin DFB.
Typical use: Coherent and high-speed optical modules where fiber pigtails exit from a flat butterfly footprint.
Why this line: Butterfly outlines standardize TEC placement, fiber bend radius, and monitor photodiode routing versus round TO cans.
Butterfly-style hermetic package — 14-Pin Side-Window Package.
Typical use: Coherent and high-speed optical modules where fiber pigtails exit from a flat butterfly footprint.
Why this line: Butterfly outlines standardize TEC placement, fiber bend radius, and monitor photodiode routing versus round TO cans.
Butterfly-style hermetic package — BOX Side-Mount 14-Pin Base.
Typical use: Coherent and high-speed optical modules where fiber pigtails exit from a flat butterfly footprint.
Why this line: Butterfly outlines standardize TEC placement, fiber bend radius, and monitor photodiode routing versus round TO cans.
Butterfly-style hermetic package — 8-Channel Hermetic Housing.
Typical use: Coherent and high-speed optical modules where fiber pigtails exit from a flat butterfly footprint.
Why this line: Butterfly outlines standardize TEC placement, fiber bend radius, and monitor photodiode routing versus round TO cans.
BOX cavity hermetic housing — Modulator Housing 2.208.
Typical use: Multi-die lidar emitters, RGB laser engines, and modules that need a rectangular cavity for bar stacks or micro-optics.
Why this line: BOX cavities give a flat mounting floor and rectangular lid — easier for array optics than a round TO stem.
BOX cavity hermetic housing — Erbium-Glass Laser Housing.
Typical use: Multi-die lidar emitters, RGB laser engines, and modules that need a rectangular cavity for bar stacks or micro-optics.
Why this line: BOX cavities give a flat mounting floor and rectangular lid — easier for array optics than a round TO stem.
BOX cavity hermetic housing — Dual-Laser Housing .311.
Typical use: Multi-die lidar emitters, RGB laser engines, and modules that need a rectangular cavity for bar stacks or micro-optics.
Why this line: BOX cavities give a flat mounting floor and rectangular lid — easier for array optics than a round TO stem.
Hermetic metal-ceramic package — Erbium-Glass Laser Housing.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Hermetic metal-ceramic package — High-Conductivity OFHC Copper Housing.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Hermetic metal-ceramic package — Laser Diode Housing.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Hermetic metal-ceramic package — Laser Projection Module Housing.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Hermetic metal-ceramic package — Gas Detector Housing.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Hermetic metal-ceramic package — 14-Pin Through-Hole Package.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Hermetic metal-ceramic package — Dual-In-Line (DIP) Package Housing.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Hermetic metal-ceramic package — M01 HTCC Ceramic Package.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Hermetic metal-ceramic package — BOX Side-Pin Package.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Hermetic metal-ceramic package — 14-Pin Laser Housing.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Hermetic metal-ceramic package — LCC08.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Hermetic metal-ceramic package — LL.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Hermetic metal-ceramic package — SMD 0.5.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Hermetic metal-ceramic package — TOSA / ROSA Housing.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Hermetic metal-ceramic package — HTCC Green Ceramic Sheet.
Typical use: Hybrid integrated circuits, photodiode arrays, and RF photonics where multiple leads must stay hermetic through HTCC or glass-seal construction.
Why this line: Pin field and cavity height are fixed per drawing — match your die stack height and bond wire loop profile before quoting.
Butterfly & cavity packages
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