Ceramic stands, brackets, and mounting hardware position submounts, TECs, and heat spreaders inside a hermetic module — part of the package stack, not die-level spreading.
Pair with die-level thermal — laser submount catalog, datacom submounts, or order SiC/ALN samples.
Define stack height from die active area to package floor or heat sink. Specify metallization (Au, Ni-Au) and whether the stand is purely mechanical or part of the thermal path.
5 outlines in catalog
Ceramic standoff or mounting bracket — Ceramic Standoff Type 1.
Typical use: Mechanical spacing and thermal isolation between submount, TEC, and heat sink in laser or sensor assemblies.
Why this line: Stand height and metallization pattern position the die at the correct focal or thermal interface.
Ceramic standoff or mounting bracket — Ceramic Standoff Type 2.
Typical use: Mechanical spacing and thermal isolation between submount, TEC, and heat sink in laser or sensor assemblies.
Why this line: Stand height and metallization pattern position the die at the correct focal or thermal interface.
Ceramic standoff or mounting bracket — Ceramic Standoff Type 3.
Typical use: Mechanical spacing and thermal isolation between submount, TEC, and heat sink in laser or sensor assemblies.
Why this line: Stand height and metallization pattern position the die at the correct focal or thermal interface.
Ceramic standoff or mounting bracket — Ceramic Standoff Type 4.
Typical use: Mechanical spacing and thermal isolation between submount, TEC, and heat sink in laser or sensor assemblies.
Why this line: Stand height and metallization pattern position the die at the correct focal or thermal interface.
Ceramic standoff or mounting bracket — Ceramic Standoff Type 5.
Typical use: Mechanical spacing and thermal isolation between submount, TEC, and heat sink in laser or sensor assemblies.
Why this line: Stand height and metallization pattern position the die at the correct focal or thermal interface.
Mount hardware & ceramic stands
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